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BYM11-600 Fiches technique(PDF) 3 Page - Vishay Siliconix |
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BYM11-600 Fiches technique(HTML) 3 Page - Vishay Siliconix |
3 / 4 page Document Number 88547 26-Jun-06 www.vishay.com 3 BYM11-50 thru BYM11-1000, RGL41A thru RGL41M Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) Figure 3. Typical Instantaneous Forward Characteristics Figure 4. Typical Reverse Characteristics 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1 10 Instantaneous Forward Voltage (V) Tj = 25 °C Pulse Width = 300 µs 1 % Duty Cycle 0 20 40 60 80 100 0.01 0.1 1 10 Percent of Rated Peak Reverse Voltage (%) Tj = 100 °C Tj = 25 °C Figure 5. Typical Junction Capacitance Figure 6. Typical Transient Thermal Impedance 1 10 100 1 10 100 Reverse Voltage (V) Tj = 25 °C f = 1.0 MHz Vsig = 50 mVp-p 0.01 0.1 1 10 100 0.1 1 10 100 Mounted on 0.20 x 0.27" (5 x 7 mm) Copper Pad Areas t - Pulse Duration (s) SOLDERABLE ENDS 1st BAND 0.022 (0.56) 0.018 (0.46) 0.205 (5.2) 0.185(4.7) D1 = 0.105 0.095 (2.67) (2.41) D2 = D1 + 0 - 0.008 (0.20) D2 0.022 (0.56) 0.018 (0.46) DO-213AB 0.138 MAX (3.5) MAX 0.049 MIN (1.25) MIN 0.118 MIN (3.0) MIN 0.238 (6.0) REF Mounting Pad Layout 1st band denotes type and positive end (cathode) |
Numéro de pièce similaire - BYM11-600 |
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Description similaire - BYM11-600 |
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