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LM3502ITLX-35NOPB Fiches technique(PDF) 4 Page - Texas Instruments |
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LM3502ITLX-35NOPB Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 28 page LM3502 SNVS339A – SEPTEMBER 2005 – REVISED AUGUST 2006 www.ti.com Absolute Maximum Ratings (1) (2) (3) VIN Pin −0.3V to +5.5V Sw Pin −0.3V to +48V Fb Pin −0.3V to +5.5V Cntrl Pin −0.3V to +5.5V VOUT1 Pin −0.3V to +48V VOUT2 Pin −0.3V to VOUT1 En1 −0.3V to +5.5V En2 −0.3V to +5.5V Continuous Power Dissipation Internally Limited Maximum Junction Temperature (TJ-MAX) +150°C Storage Temperature Range −65°C to +150°C ESD Rating (4) Human Body Model: 2 kV Machine Model: 200V (1) All voltages are with respect to the potential at the GND pin. (2) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not apply when operating the device outside of its rated operating conditions. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Conditions (1) (2) Junction Temperature (TJ) Range −40°C to +125°C Ambient Temperature (TA) Range −40°C to +85°C Input Voltage, VIN Pin 2.5V to 5.5V Cntrl, En1, and En2 Pins 0V to 5.5V (1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not apply when operating the device outside of its rated operating conditions. (2) All voltages are with respect to the potential at the GND pin. Thermal Properties (1) Junction-to-Ambient Thermal Resistance ( θJA) DSBGA Package 65°C/W WQFN Package 49°C/W (1) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature. For more information on this topic, please refer to Application Note 1187: Leadless Leadframe Package (LLP) and Application Note 1112 (AN1112) for DSBGA chip scale package. Preliminary Electrical Characteristics (1) (2) Limits in standard typeface are for TJ = 25°C. Limits in bold typeface apply over the full operating junction temperature range ( −40°C ≤ TJ ≤ +125°C). Unless otherwise specified, VIN = 2.5V. Symbol Parameter Conditions Min Typ Max Units VIN Input Voltage 2.5 5.5 V IQ Non-Switching Fb > 0.25V 0.5 1 mA Switching Fb = 0V, Sw Is Floating 1.9 3 mA Shutdown Cntrl = 0V 0.1 3 µA Low IQ Shutdown Cntrl = 1.5V, En1 = En2 = 0V 6 15 µA VFb Feedback Voltage 0.18 0.25 0.3 V (1) All voltages are with respect to the potential at the GND pin. (2) Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. 4 Submit Documentation Feedback Copyright © 2005–2006, Texas Instruments Incorporated Product Folder Links: LM3502 |
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