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TPA6133A2 Fiches technique(PDF) 11 Page - Texas Instruments |
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TPA6133A2 Fiches technique(HTML) 11 Page - Texas Instruments |
11 / 19 page fc IN + 1 2p R IN CIN C IN + 1 2p fc IN RIN or C(DCINPUT-BLOCKING) 1 2 CIN = TPA6133A2 www.ti.com SLOS821 – JUNE 2013 CIN is a theoretical capacitor used for mathematical calculations only. Its value is the series combination of the dc input-blocking capacitors, C(DCINPUT-BLOCKING). Use Equation 3 to determine the value of C(DCINPUT-BLOCKING). For example, if CIN is equal to 0.22 μF, then C(DCINPUT-BLOCKING) is equal to about 0.47 μF. (3) The two C(DCINPUT-BLOCKING) capacitors form a high-pass filter with the input impedance of the TPA6133A2. Use Equation 3 to calculate CIN, then calculate the cutoff frequency using CIN and the differential input impedance of the TPA6133A2, RIN, using Equation 4. Note that the differential input impedance changes with gain. See for input impedance values. The frequency and/or capacitance can be determined when one of the two values are given. (4) If a high pass filter with a -3 dB point of no more than 20 Hz is desired over all gain settings, the minimum impedance would be used in the above equation. shows this to be 37 k Ω. The capacitor value by the above equation would be 0.215 μF. However, this is CIN, and the desired value is for C(DCINPUT-BLOCKING). Multiplying CIN by 2 yields 0.43 μF, which is close to the standard capacitor value of 0.47 μF. Place 0.47 μF capacitors at each input terminal of the TPA6133A2 to complete the filter. Charge Pump Flying Capacitor and CPVSS Capacitor The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage. The CPVSS capacitor must be at least equal to the flying capacitor in order to allow maximum charge transfer. Low ESR capacitors are an ideal selection, and a value of 1 µF is typical. Decoupling Capacitors The TPA6133A2 is a DirectPath™ headphone amplifier that requires adequate power supply decoupling to ensure that the noise and total harmonic distortion (THD) are low. Use good low equivalent-series-resistance (ESR) ceramic capacitors, typically 1.0 µF. Find the smallest package possible, and place as close as possible to the device VDD lead. Placing the decoupling capacitors close to the TPA6133A2 is important for the performance of the amplifier. Use a 10 μF or greater capacitor near the TPA6133A2 to filter lower frequency noise signals. The high PSRR of the TPA6133A2 will make the 10 μF capacitor unnecessary in most applications. Layout Recommendations Exposed Pad On TPA6133A2RTJ Package Solder the exposed metal pad on the TPA6133A2RTJ QFN package to the a pad on the PCB. The pad on the PCB may be grounded or may be allowed to float (not be connected to ground or power). If the pad is grounded, it must be connected to the same ground as the GND pins (3, 9, 10, 13, and 19). See the layout and mechanical drawings at the end of the datasheet for proper sizing. Soldering the thermal pad improves mechanical reliability, improves grounding of the device, and enhances thermal conductivity of the package. GND Connections The GND pin for charge pump should be decoupled to the charge pump VDD pin, and the GND pin adjacent to the Analog VDD pin should be separately decoupled to each other. Modes of Operation The TPA6133A2 supports two modes of operation. When the SD pin is driven to logic 0, the device is in low power mode where the charge pump is powered down, the headphone channel is disabled and the outputs are weakly pulled to ground. When the SD pin is driven to logic 1, the device enters an active mode with charge pump powered up and headphone channel enabled with channel gain of +4dB. The transition from inactive to active and active to inactive states is done softly to avoid audible artifacts. Copyright © 2013, Texas Instruments Incorporated 11 Product Folder Links: TPA6133A2 |
Numéro de pièce similaire - TPA6133A2_14 |
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Description similaire - TPA6133A2_14 |
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