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SM075 Datasheet(Fiches technique) 3 Page - StarHope

Numéro de pièce SM075
Description  Surface Mount Devices
Télécharger  3 Pages
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Fabricant  SPSEMI [StarHope]
Site Internet  http://www.spsemi.cn
Logo SPSEMI - StarHope

SM075 Datasheet(HTML) 3 Page - StarHope

  SM075 Datenblatt HTML 1Page - StarHope SM075 Datenblatt HTML 2Page - StarHope SM075 Datasheet HTML 3Page - StarHope  
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Termination pad characteristics
Terminal pad materials
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Terminal pad solderability
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Thermal Derating Curve
Typical Time-To-Trip At 25°C
Derating Curves for SMD Series
0
20
40
60
80
100
120
140
160
-40
-20
0
20
40
60
80
Temperature (°C)
Average Time Current Curves
0.01
0.1
1
10
100
0
0
1
0
1
1
1
.
0
Current In Amperes
3.00A
0.50A
0.75A
1.00A
1.25A
1.5A
1.85A
2.0A
2.5A
2.6A
0.3A
Package Information
Reel:
SM030~300
2000pcs/Reel
Recommended Solder Reflow Conditions
Soldering
‧Recommended reflow methods:IR, vapor phase oven, hot air oven.
‧Devices are not designed to be wave soldered to the bottom side
of the board.
‧Recommended maximum paste thickness is 0.25 mm (0.010 inch).
‧Devices can be cleaned using standard method and solvents.
Note:If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
SM
SMD SeriesPreheating
Cooling
60-120
sec.
120
sec.
30-60
sec.
300
200
160
0
250
190
100
PPTC/SM Series
03 | www.spsemi.cn
REV.2014.05.01


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