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AD324-00 Fiches technique(PDF) 1 Page - List of Unclassifed Manufacturers

No de pièce AD324-00
Description  Package Drawings and Specifications
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Fabricant  ETC2 [List of Unclassifed Manufacturers]
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AD324-00 Fiches technique(HTML) 1 Page - List of Unclassifed Manufacturers

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Appendix
- 131 -
www.nve.com phone: 952-829-9217 fax: 952-829-9189
Appendix
Package Drawings and Specifications
Package Drawing – SOIC8
Dimensions: inch (mm)
.154 (3.91)
.020 (.508)
.188 (4.77)
.054 (1.37)
.061 (1.55)
.154 (3.91)
.236 (5.99)
.017 TYP.
.193 (4.90)
NVE
XXXXX
-XX
.050 (1.27) x 6
BASIC
.004 (.10) MIN.
.010 (.26) MAX.
.016 (.40) NOM.
.015 (.381)
x45°
Note: SOIC8 Package has thermal power dissipation of 240°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.
Package Drawing – MSOP8
Dimensions: inches (mm)
.118 (3.00)
.021 (.533)
.154 (3.91)
.034 (.86)
.040 (1.02)
.004 (.10) MIN.
.012 (.31) MAX.
.0256 (.65) x 6
BASIC
NVE
XXX
.118 (3.00)
.193 (4.90)
.012 TYP.
.118
(3.00)
.005 (.13) NOM.
Note: MSOP8 Package has thermal power dissipation of 320°C/Watt in free air.
Attaching the package to a circuit board improves thermal performance.


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