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L6747C Fiches technique(PDF) 5 Page - STMicroelectronics |
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L6747C Fiches technique(HTML) 5 Page - STMicroelectronics |
5 / 15 page L6747C Pin information and thermal data Doc ID 17127 Rev 1 5/15 2.2 Thermal data Table 3. Thermal data 8UGATE High-side driver output. Connect to high-side MOSFET gate. A small series resistor may be used to control the PHASE pin negative spike. -TH. PAD Thermal pad connects the silicon substrate and makes good thermal contact with the PCB. Connect to the PGND plane. Table 2. Pin descriptions (continued) Pin # Name Function Symbol Parameter Value Unit RTHJA Thermal resistance junction-to-ambient (device soldered on 2s2p, 67mm x 69mm board) 45 °C/W RTHJC Thermal resistance junction-to-case 5 °C/W TMAX Maximum junction temperature 150 °C TSTG Storage temperature range 0 to 150 °C TJ Junction temperature range 0 to 125 °C PTOT Maximum power dissipation at 25°C (device soldered on 2s2p,67mm x 69mm board) 2.25 W |
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