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BCX52-10-115 Fiches technique(PDF) 7 Page - NXP Semiconductors |
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BCX52-10-115 Fiches technique(HTML) 7 Page - NXP Semiconductors |
7 / 22 page BCP52_BCX52_BC52PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 9 — 18 October 2011 7 of 22 NXP Semiconductors BCP52; BCX52; BC52PA 60 V, 1 A PNP medium power transistors FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values FR4 PCB, mounting pad for collector 1 cm2 Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values 006aac677 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10–2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac678 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10–2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 |
Numéro de pièce similaire - BCX52-10-115 |
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Description similaire - BCX52-10-115 |
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