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DLW43S Fiches technique(PDF) 70 Page - Murata Manufacturing Co., Ltd. |
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DLW43S Fiches technique(HTML) 70 Page - Murata Manufacturing Co., Ltd. |
70 / 93 page DLW43S oReflow Soldering ∗ 1 : If the pattern is made with wider than 3.4mm, it may result in components turning around, because melting speed is different. In the worst case, short circuit between lines may be occur. ∗ 2 : If the pattern is made with less than 1.6mm, in the worst case, short circuit between lines may occur due to the spread of soldering paste or mount placing accuracy. ∗ 3 : If the pattern is made with wider, the strength of bending will be reduced. Do not use gilded pattern; excess soldering heat may dissolve metal of a copper wire. Land Pattern Land Pattern + Solder Resist Solder Resist (in mm) Continued from the preceding page. Continued on the following page. DLW43SH510XK2 3.0 DLW43SH101XK2 DLW43SH101XP2 3.2 Series a a ∗3 5.9 DLW31S oReflow Soldering ∗ 1 : If the pattern is made with wider than 1.6mm (DLW31S) it may result in components turning around, because melting speed is different. In the worst case, short circuit between lines may occur. ∗ 2 : If the pattern is made with less than 0.4mm, in the worst case, short circuit between lines may occur due to spread of soldering paste or mount placing accuracy. ∗ 3 : If the pattern is made with wider than 1.6mm (DLW31S), the bending strength will be reduced. Do not use gilded pattern; excess soldering heat may dissolve metal of a copper wire. DLW31S 1.6 0.4 Series a 1.6 d 3.7 b c a ∗3 b 2. Solder Paste Printing and Adhesive Application BLM15 BLM18 BLM21 BLM31 BLM41 Coating amount is illustrated in the following diagram. When reflow soldering the chip EMI suppression filter, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB and may crack. In contrast, if too little solder is applied, there is the potential that the termination strength will be insufficient, creating the potential for detachment. Standard land dimensions should be used for resist and copper foil patterns. When flow soldering the EMI suppression filter, apply the adhesive in accordance with the following conditions. If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering process. (in mm) oEnsure that solder is applied smoothly to a minimum height of 0.2mm to 0.3mm at the end surface of the part. oCoat the solder paste a thickness: 100-200 µm a:20 −70µm b:30 −35µm c:50 −105µm c a b Chip Solid Inductor Bonding agent Land PCB Series Solder Paste Printing Adhesive Application Chip EMIFILr (Soldering and Mounting) 68 4 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. C50E.pdf Aug.28,2008 |
Numéro de pièce similaire - DLW43S |
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Description similaire - DLW43S |
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