DLW43S

oReflow Soldering

∗ 1 : If the pattern is made with wider than 3.4mm, it may result

in components turning around, because melting speed is

different. In the worst case, short circuit between lines

may be occur.

∗ 2 : If the pattern is made with less than 1.6mm, in the worst

case, short circuit between lines may occur due to the

spread of soldering paste or mount placing accuracy.

∗ 3 : If the pattern is made with wider, the strength of bending

will be reduced.

Do not use gilded pattern; excess soldering heat may dissolve

metal of a copper wire.

Land Pattern

Land Pattern

+ Solder Resist

Solder Resist

(in mm)

Continued from the preceding page.

Continued on the following page.

DLW43SH510XK2

3.0

DLW43SH101XK2

DLW43SH101XP2

3.2

Series

a

a

∗3

5.9

DLW31S

oReflow Soldering

∗ 1 : If the pattern is made with wider than 1.6mm (DLW31S) it

may result in components turning around, because

melting speed is different. In the worst case, short circuit

between lines may occur.

∗ 2 : If the pattern is made with less than 0.4mm, in the worst

case, short circuit between lines may occur due to spread

of soldering paste or mount placing accuracy.

∗ 3 : If the pattern is made with wider than 1.6mm (DLW31S),

the bending strength will be reduced.

Do not use gilded pattern; excess soldering heat may dissolve

metal of a copper wire.

DLW31S

1.6

0.4

Series

a

1.6

d

3.7

b

c

a

∗3

b

2. Solder Paste Printing and Adhesive Application

BLM15

BLM18

BLM21

BLM31

BLM41

Coating amount is illustrated in the

following diagram.

When reflow soldering the chip EMI suppression filter, the

printing must be conducted in accordance with the

following cream solder printing conditions.

If too much solder is applied, the chip will be prone to

damage by mechanical and thermal stress from the PCB

and may crack. In contrast, if too little solder is applied,

there is the potential that the termination strength will be

insufficient, creating the potential for detachment.

Standard land dimensions should be used for resist and

copper foil patterns.

When flow soldering the EMI suppression filter, apply the

adhesive in accordance with the following conditions.

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderability.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering process.

(in mm)

oEnsure that solder is applied smoothly to a

minimum height of 0.2mm to 0.3mm at the end

surface of the part.

oCoat the solder paste a thickness: 100-200

µm

a:20

−70µm

b:30

−35µm

c:50

−105µm

c

a

b

Chip Solid Inductor

Bonding agent

Land

PCB

Series

Solder Paste Printing

Adhesive Application

Chip EMIFILr (Soldering and Mounting)

68

4

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

C50E.pdf

Aug.28,2008