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CSFR102 Fiches technique(PDF) 1 Page - Cystech Electonics Corp. |
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CSFR102 Fiches technique(HTML) 1 Page - Cystech Electonics Corp. |
1 / 3 page CYStech Electronics Corp. Spec. No. : C339SF Issued Date : 2003.06.16 Revised Date :2007.08.24 Page No. : 1/3 CSFR10XSF CYStek Product Specification 1.0Amp. Surface Mount Ultra Fast Recovery Diodes CSFR10XSF Series Features • For surface mounted applications. • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data • Case: Molded plastic, JEDEC SOD-123/Mini SMA. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Packaging: 12mm tape per EIA STD RS-481. • Weight: 0.04 gram Maximum Ratings and Electrical Characteristics ( Rating at 25 °C ambient temperature unless otherwise specified. ) Type Parameter Symbol CSFR 101 CSFR 102 CSFR 103 CSFR 104 CSFR 105 CSFR 106 CSFR 107 Units Repetitive peak reverse voltage VRRM 50 100 200 300 400 600 800 V Maximum RMS voltage VRMS 35 70 140 210 280 420 560 V Maximum DC blocking voltage VR 50 100 200 300 400 600 800 V Maximum instantaneous forward voltage, IF=1A (Note 1) VF 1 1 1 1.3 1.3 1.7 1.7 V Reverse Recovery Time trr 50 50 50 50 50 75 75 ns Average forward rectified current @TA=50℃ IO 1 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 30 A Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=125℃(Note 1) IR 5 150 μA μA Maximum thermal resistance, Junction to ambient Rth,JA 42 (typ) ℃ /W Diode junction capacitance (Note 2) CJ 20 (typ) pF Storage temperature Tstg -55 ~ +150 ℃ Operating temperature TJ -55 ~ +150 ℃ Notes : 1. Pulse test, pulse width=300μsec, 2% duty cycle 2 . f=1MHz and applied 4.0VDC reverse voltage. |
Numéro de pièce similaire - CSFR102 |
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Description similaire - CSFR102 |
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