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BAR40SN3 Fiches technique(PDF) 7 Page - Cystech Electonics Corp.

No de pièce BAR40SN3
Description  Small Signal Schottky (double) diodes
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Fabricant  CYSTEKEC [Cystech Electonics Corp.]
Site Internet  http://www.cystekec.com
Logo CYSTEKEC - Cystech Electonics Corp.

BAR40SN3 Fiches technique(HTML) 7 Page - Cystech Electonics Corp.

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CYStech Electronics Corp.
Spec. No. : C302N3
Issued Date : 2011.06.27
Revised Date : 2012.02.07
Page No. : 7/7
BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3
CYStek Product Specification
SOT-23 Dimension
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Marking:
Diagram:
L4_
XXX
3-Lead SOT-23 Plastic Surface Mounted
Package.
CYStek Package Code: N3
• BAR40 N3: Single Diode.
(Marking Code JV3)
• BAR40AN3: Common Anode. (Marking Code B6)
• BAR40CN3: Common Cathode. (Marking Code 5C)
• BAR40SN3: Series Connected. (Marking Code LD3)
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.


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