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LM7372MRNOPB Fiches technique(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No de pièce LM7372MRNOPB
Description  LM7372 High Speed, High Output Current, Dual Operational Amplifier
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Fabricant  NSC [National Semiconductor (TI)]
Site Internet  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM7372MRNOPB Fiches technique(HTML) 2 Page - National Semiconductor (TI)

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LM7372
SNOS926E – MAY 1999 – REVISED MARCH 2013
www.ti.com
Connection Diagrams
* Heatsink Pins.(1)
Figure 2. 16-Pin SOIC, Top View
Figure 3. 8-Pin SO PowerPAD, Top View
NOTE
For SO PowerPAD package the exposed pad should be tied either to Vor left electrically
floating.
(Die attach material is conductive and is internally tied to V)
(1)
The maximum power dissipation is a function of T(JMAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T(JMAX) – TA)/θJA. All numbers apply for packages soldered directly into a PC board. The value for θJA is 106°C/W
for the 16-Pin SOIC package. With a total area of 4sq. in of 1oz CU connected to pins 1,6,8,9 & 16,
θJA for the 16-Pin SOIC is
decreased to 70°C/W. 8-Pin SO PowerPAD package
θJA is with 2 in
2 heatsink (top and bottom layer each) and 1 oz. copper (see
Table 2).
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7372


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