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OPA650UB Fiches technique(PDF) 3 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
No de pièce OPA650UB
Description  Wideband, Low Power Voltage Feedback OPERATIONAL AMPLIFIER
Download  12 Pages
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Fabricant  BURR-BROWN [Burr-Brown (TI)]
Site Internet  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

OPA650UB Fiches technique(HTML) 3 Page - Burr-Brown (TI)

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®
OPA650
3
1
2
3
5
4
+V
S
–Input
Output
–V
S
+Input
1
2
3
4
8
7
6
5
NC
+V
S
Output
NC
NC
–Input
+Input
–V
S
Supply ...............................................................................................
±5.5V
Internal Power Dissipation .................................. See Thermal Conditions
Differential Input Voltage ..................................................................
±1.2V
Input Voltage Range ............................................................................
±V
S
Storage Temperature Range: P, U, UB, N, NB ............ –40
°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300
°C
(soldering, SOIC 3s) ....................................... +260
°C
Junction Temperature (TJ ) ............................................................ +175°C
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
Top View
DIP/SO-8
SOT23-5
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility
for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or
licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support
devices and/or systems.
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per-
formance degradation to complete device failure. Burr-Brown
Corporation recommends that all integrated circuits be handled
and stored using appropriate ESD protection methods.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet published speci-
fications.
PACKAGE
DRAWING
TEMPERATURE
PACKAGE
ORDERING
PRODUCT
PACKAGE
NUMBER(1)
RANGE
MARKING(2)
NUMBER(3)
OPA650U
SO-8 Surface Mount
182
–40
°C to +85°C
OPA650U
OPA650U
OPA650UB
SO-8 Surface Mount
182
–40
°C to +85°C
OPA650UB
OPA650UB
OPA650N
5-pin SOT23-5
331
–40
°C to +85°C
A50
OPA650N-250
OPA650N-3k
OPA650NB
5-pin SOT23-5
331
–40
°C to +85°C
A50B
OPA650NB-250
OPA650NB-3k
OPA650P
8-Pin Plastic DIP
006
–40
°C to +85°C
OPA650P
OPA650P
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) The “B” grade of the SO-8 package
will be marked with a “B” by pin 8. The “B” grade of the SOT23-5 will be marked with a “B” near pins 3 and 4. (3) The SOT23-5 is only available on a 7" tape and reel
(e.g. ordering 250 pieces of “OPA650N-250” will get a single 250 piece tape and reel. Ordering 3000 pieces of “OPA650N-3k” will get a single 3000 piece tape and reel).
Please refer to Appendix B of Burr-Brown IC Data Book for detailed Tape and Reel Mechanical information.
PACKAGE/ORDERING INFORMATION


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