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OPA4658 Fiches technique(PDF) 3 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
No de pièce OPA4658
Description  Quad Wideband, Low Power Current Feedback OPERATIONAL AMPLIFIER
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Fabricant  BURR-BROWN [Burr-Brown (TI)]
Site Internet  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

OPA4658 Fiches technique(HTML) 3 Page - Burr-Brown (TI)

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3
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OPA4658
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Output 4
–Input 4
+Input 4
–V
S
+Input 3
–Input 3
Output 3
Output 1
–Input 1
+Input 1
+V
S
+Input 2
–Input 2
Output 2
ABSOLUTE MAXIMUM RATINGS
Supply ..........................................................................................
±5.5VDC
Internal Power Dissipation(1) ....................... See Applications Information
Differential Input Voltage .............................................................. Total VS
Input Voltage Range .................................... See Applications Information
Storage Temperature Range: P, U, UB ........................ –40
°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300
°C
(soldering, SOIC 3s) ...................................................................... +260
°C
Junction Temperature (TJ ) ............................................................ +175°C
NOTE: (1) Packages must be derated based on specified
θ
JA. Maximum
TJ must be observed.
PACKAGE INFORMATION
PACKAGE DRAWING
PRODUCT
PACKAGE
NUMBER(1)
OPA4658P
14-Pin Plastic DIP
010
OPA4658U, UB
SO-14 Surface Mount
235
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PIN CONFIGURATION
Top View
DIP/SO-14
ORDERING INFORMATION(1)
PRODUCT
PACKAGE
TEMPERATURE RANGE
OPA4658P
14-Pin Plastic DIP
–40
°C to +85°C
OPA4658U, UB
SO-14 Surface Mount
–40
°C to +85°C
NOTE: (1) The "B" grade of the SOIC package will be marked with a "B" by pin 8.
Refer to mechanical section for the location.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.


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