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TPS40053PWP Fiches technique(PDF) 2 Page - Texas Instruments |
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TPS40053PWP Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 37 page TPS40050 TPS40051 TPS40053 SLUS540F − DECEMBER 2002 − REVISED JUNE 2004 www.ti.com 2 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA APPLICATION PACKAGE PART NUMBER SOURCE(2) Plastic HTSSOP (PWP)(1) TPS40050PWP −40 °C to 85°C SOURCE/SINK(2) Plastic HTSSOP (PWP)(1) TPS40051PWP −40 C to 85 C SOURCE/SINK(2) with prebias Plastic HTSSOP (PWP)(1) TPS40053PWP (1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS40050PWPR). See the application section of the data sheet for PowerPAD drawing and layout information. (2) See Application Information section, pg. 7 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(3) TPS40050 TPS40051 TPS40053 UNIT VIN 45 VFB, SS, SYNC −0.3 to 6 Input voltage range, VIN SW −0.3 to 45 V Input voltage range, VIN SW, transient < 50 ns −2.5 V KFF, with IIN(max) = −5 mA −0.3 to 11 Output voltage range, VOUT COMP, RT, SS −0.3 to 6 Input current, IIN KFF 5 mA Output current, IOUT RT 200 µA Operating junction temperature range, TJ −40 to 125 Storage temperature, Tstg −55 to 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 C (3) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Input voltage, VI 8 40 V Operating free-air temperature, TA −40 85 °C THERMAL PAD 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 KFF RT BP5 SYNC SGND SS/SD VFB COMP ILIM VIN BOOST HDRV SW BP10 LDRV PGND PWP PACKAGE(4)(5) (TOP VIEW) (4) For more information on the PWP package, refer to TI Technical Brief, Literature No. SLMA002. (5) PowerPADt heat slug must be connected to SGND (pin 5) or electrically isolated from all other pins. |
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