Moteur de recherche de fiches techniques de composants électroniques |
|
TLC1079CDR Fiches technique(PDF) 3 Page - Texas Instruments |
|
|
TLC1079CDR Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 36 page TLC1078, TLC1078Y, TLC1079, TLC1079Y LinCMOS µPOWER PRECISION OPERATIONAL AMPLIFIERS SLOS179A – FEBRUARY 1997 – REVISED MARCH 2001 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC1087Y chip information This chip, when properly assembled, displays characteristics similar to the TLC1078C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips can be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. + – 1OUT 1IN + 1IN – VDD VDD – /GND (8) (3) (2) (4) + – 2OUT 2IN + 2IN – (5) (6) 83 72 (1) (5) (4) (3) (2) (6) (7) (8) BONDING PAD ASSIGNMENTS |
Numéro de pièce similaire - TLC1079CDR |
|
Description similaire - TLC1079CDR |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |