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LM3444MANOPB Fiches technique(PDF) 4 Page - Texas Instruments

No de pièce LM3444MANOPB
Description  AC-DC Offline LED Driver
Download  30 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

LM3444MANOPB Fiches technique(HTML) 4 Page - Texas Instruments

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LM3444
SNVS682C – NOVEMBER 2010 – REVISED MAY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Limits in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature
Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: VCC = 12V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VCC SUPPLY
IVCC
Operating supply current
1.58
2.25
mA
VCC-UVLO
Rising threshold
7.4
7.7
V
Falling threshold
6.0
6.4
Hysterisis
1
COFF
VCOFF
Time out threshold
1.22
1.276
1.327
V
5
RCOFF
Off timer sinking impedance
33
60
tCOFF
Restart timer
180
µs
CURRENT LIMIT
VISNS
ISNS limit threshold
1.17
1.269
1.364
V
4
tISNS
Leading edge blanking time
125
ns
Current limit reset delay
180
µs
ISNS limit to GATE delay
ISNS = 0 to 1.75V step
33
ns
CURRENT SENSE COMPARATOR
VFILTER
FILTER open circuit voltage
720
750
780
mV
RFILTER
FILTER impedance
1.12
M
VOS
Current sense comparator offset voltage
-4.0
0.1
4.0
mV
GATE DRIVE OUTPUT
VDRVH
GATE high saturation
IGATE = 50 mA
0.24
0.50
V
VDRVL
GATE low saturation
IGATE = 100 mA
0.22
0.50
IDRV
Peak souce current
GATE = VCC/2
-0.77
A
Peak sink current
GATE = VCC/2
0.88
tDV
Rise time
Cload = 1 nF
15
ns
Fall time
Cload = 1 nF
15
THERMAL SHUTDOWN
TSD
Thermal shutdown temperature
See (1)
165
°C
Thermal shutdown hysteresis
20
THERMAL SPECIFICATION
RθJA
VSSOP junction to ambient
124
°C/W
RθJC
VSSOP junction to case
76
(1)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation
of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as
given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
4
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