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LM3444MANOPB Fiches technique(PDF) 4 Page - Texas Instruments |
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LM3444MANOPB Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 30 page LM3444 SNVS682C – NOVEMBER 2010 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS Limits in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VCC = 12V. Symbol Parameter Conditions Min Typ Max Units VCC SUPPLY IVCC Operating supply current 1.58 2.25 mA VCC-UVLO Rising threshold 7.4 7.7 V Falling threshold 6.0 6.4 Hysterisis 1 COFF VCOFF Time out threshold 1.22 1.276 1.327 V 5 RCOFF Off timer sinking impedance 33 60 Ω tCOFF Restart timer 180 µs CURRENT LIMIT VISNS ISNS limit threshold 1.17 1.269 1.364 V 4 tISNS Leading edge blanking time 125 ns Current limit reset delay 180 µs ISNS limit to GATE delay ISNS = 0 to 1.75V step 33 ns CURRENT SENSE COMPARATOR VFILTER FILTER open circuit voltage 720 750 780 mV RFILTER FILTER impedance 1.12 M Ω VOS Current sense comparator offset voltage -4.0 0.1 4.0 mV GATE DRIVE OUTPUT VDRVH GATE high saturation IGATE = 50 mA 0.24 0.50 V VDRVL GATE low saturation IGATE = 100 mA 0.22 0.50 IDRV Peak souce current GATE = VCC/2 -0.77 A Peak sink current GATE = VCC/2 0.88 tDV Rise time Cload = 1 nF 15 ns Fall time Cload = 1 nF 15 THERMAL SHUTDOWN TSD Thermal shutdown temperature See (1) 165 °C Thermal shutdown hysteresis 20 THERMAL SPECIFICATION RθJA VSSOP junction to ambient 124 °C/W RθJC VSSOP junction to case 76 (1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 4 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM3444 |
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