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AD7890SQ-10QML Fiches technique(PDF) 3 Page - List of Unclassifed Manufacturers

No de pièce AD7890SQ-10QML
Description  STANDARD MICROCIRCUIT DRAWING
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STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-95615
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
C
SHEET
3
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings. 1/
VDD to AGND ................................................................................................................. -0.3 V dc to +7 V dc
VDD to DGND ................................................................................................................. -0.3 V dc to +7 V dc
Analog input voltage to AGND.......................................................................................
±17 V dc
Reference input voltage to AGND ................................................................................. -0.3 V dc to VDD + 0.3 V dc
Digital input voltage to DGND........................................................................................ -0.3 V dc to VDD + 0.3 V dc
Digital output voltage to DGND...................................................................................... -0.3 V dc to VDD + 0.3 V dc
Junction temperature (TJ) .............................................................................................. +150
°C
Power dissipation (PD) ................................................................................................... 450 mW
Thermal resistance, junction-to-ambient (
θJA) ............................................................... 70°C/W
Thermal resistance, junction-to-case (
θJC) .................................................................... See MIL-STD-1835
Lead temperature (soldering, 10 seconds).................................................................... +300
°C
1.4 Recommended operating conditions.
Ambient operating temperature range........................................................................... -55
°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 -
Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
List of Standard Microcircuit Drawings.
MIL-HDBK-780 -
Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.


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