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ADV7614 Fiches technique(PDF) 8 Page - Analog Devices

No de pièce ADV7614
Description  12-Bit Deep Color with Quad HDMI Receiver
Download  20 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADV7614 Fiches technique(HTML) 8 Page - Analog Devices

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ADV7614
Data Sheet
Rev. C | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
DVDD to GND
2.2 V
PVDD to GND
2.2 V
DVDDIO to GND
4.0 V
CVDD to GND
2.2 V
TVDD to GND
4.0 V
Digital Inputs Voltage to GND
GND − 0.3 V to
DVDDIO + 0.3 V
5 V Tolerant Digital Inputs to GND1
5.3 V
Digital Output Voltage to GND
GND − 0.3 V to
DVDDIO + 0.3 V
XTAL Pins
−0.3 V to PVDD
to 0.3 V
Maximum Junction Temperature (TJ MAX)
125°C
Storage Temperature
150°C
Infrared Reflow Soldering (20 sec)
260°C
1
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,
DDCA_SDA, DDCB_SCL, DDCB_SDA, DDCC_SCL, DDCC_SDA, DDCD_SCL,
DDCD_SDA, RXA_5V, RXB_5V, RXC_5V, RXD_5V, SHARED_EDID, PWRDN,
EP_MISO.
Stresses abovethoselisted under AbsoluteMaximumRatings
may cause permanent damageto the device. This is a stress
rating only; functional operation of the device at these orany
other conditions above thoseindicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce powerconsumption when using the ADV7614, the
user is advised to turn off unused sections of the part.
Due to printed circuit board (PCB)metal variation and, thus,
variation in PCB heat conductivity, the value of θJA may differ
for various PCBs.
The most efficient measurement solution is obtainedusing the
package surface temperatureto estimatethe die temperature
becausethis eliminatesthevarianceassociated with theθJA value.
The maximum junction temperature (TJ MAX)of 125°C must not
be exceeded. The following equation calculatesthe junction
temperature using the measuredpackage surface temperature
and applies only when no heat sinkis used on the device under
test (DUT):
TJ = TS + (ΨJT × WTOTAL)
where:
TS is the package surface temperature(°C).
ΨJT = 0.3°C/W for a 260-ball CSP_BGA.
WTOTAL = ((PVDD × IPVDD)+ (0.05 ×TVDD × ITVDD)+ (CVDD ×
ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO)).
Note that for WTOTAL, 5% of TVDD power is dissipated on the
part itself.
ESD CAUTION


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