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LM3445 Fiches technique(PDF) 4 Page - Texas Instruments |
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LM3445 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 39 page LM3445 SNVS570L – JANUARY 2009 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Limits in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = +25ºC, and are provided for reference purposes only. Symbol Parameter Conditions Min Typ Max Units INTERNAL PWM RAMP fRAMP Frequency 5.85 kHz VRAMP Valley voltage 0.96 1.00 1.04 V Peak voltage 2.85 3.00 3.08 DRAMP Maximum duty cycle 96.5 98.0 % DIM DECODER tANG_DET Angle detect rising threshold Observed on BLDR pin 6.79 7.21 7.81 V VASNS ASNS filter delay 4 µs ASNS VMAX 3.85 4.00 4.15 V IASNS ASNS drive capability sink VASNS = 2V 7.6 mA ASNS drive capability source VASNS = 2V -4.3 DIM low sink current VDIM = 1V 1.65 2.80 DIM High source current VDIM = 4V -4.00 -3.00 VDIM DIM low voltage PWM input voltage 0.9 1.33 V threshold DIM high voltage 2.33 3.15 VTSTH Tri-state threshold voltage Apply to FLTR1 pin 4.87 5.25 V RDIM DIM comparator tri-state impedance 10 M Ω CURRENT SENSE COMPARATOR VFLTR2 FLTR2 open circuit voltage 720 750 780 mV RFLTR2 FLTR2 impedance 420 k Ω VOS Current sense comparator offset voltage -4.0 0.1 4.0 mV GATE DRIVE OUTPUT VDRVH GATE high saturation IGATE = 50 mA 0.24 0.50 V VDRVL GATE low saturation IGATE = 100 mA 0.22 0.50 IDRV Peak souce current GATE = VCC/2 -0.77 A Peak sink current GATE = VCC/2 0.88 tDV Rise time Cload = 1 nF 15 ns Fall time Cload = 1 nF 15 THERMAL SHUTDOWN TSD Thermal shutdown temperature See (1) 165 °C Thermal shutdown hysteresis 20 THERMAL SHUTDOWN RθJA VSSOP-10 junction to ambient 121 °C/W (1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 4 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3445 |
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