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TPS54540-Q1 Fiches technique(PDF) 4 Page - Texas Instruments |
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TPS54540-Q1 Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 44 page TPS54540-Q1 SLVSC56A – SEPTEMBER 2013 – REVISED OCTOBER 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT MIN MAX VIN –0.3 65 EN –0.3 8.4 BOOT 73 Input voltage V FB –0.3 3 COMP –0.3 3 RT/CLK –0.3 3.6 BOOT-SW 8 Output voltage SW –0.6 65 V SW, 10-ns Transient –2 65 Electrostatic Discharge (HBM) QSS 009-105 (JESD22-A114A) and AEC-Q100 2 kV Electrostatic Discharge (CDM) QSS 009-147 (JESD22-C101B.01) and AEC-Q100 750 V Operating junction temperature -40 150 °C Storage temperature -65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPS54540-Q1 THERMAL METRIC(1)(2) UNIT DDA (8 PINS) θJA Junction-to-ambient thermal resistance (standard board) 42 ψJT Junction-to-top characterization parameter 5.9 ψJB Junction-to-board characterization parameter 23.4 °C/W θJCtop Junction-to-case(top) thermal resistance 45.8 θJCbot Junction-to-case(bottom) thermal resistance 3.6 θJB Junction-to-board thermal resistance 23.4 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where distortion starts to substantially increase. See power dissipation estimate in application section of this data sheet for more information. 4 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS54540-Q1 |
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