TPS709

SBVS186E – MARCH 2012 – REVISED NOVEMBER 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

XX is the nominal output voltage (for example 28 = 2.8 V).

TPS709xxyyyz

YYY is the package designator

Z is the package quantity; R is for reel (3000 pieces), T is for tape (250 pieces)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

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VALUE

MIN

MAX

UNIT

–0.3

+32

V

Voltage

–0.3

+7

V

–0.3

+7

V

Maximum output current

Internally limited

Output short-circuit duration

Indefinite

Continuous total power dissipation

See the Thermal Information table

–55

+150

°C

Temperature

–55

+150

°C

Human body model (HBM)

2

kV

Electrostatic discharge (ESD) ratings

Charged device model (CDM)

500

V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

THERMAL INFORMATION

TPS709xx

DBV

DCY

DRV

UNITS

(SOT-23)

(SOT-223)

(SON)

5 PINS

4 PINS

6 PINS

Junction-to-ambient thermal resistance

212.1

64.7

73.1

Junction-to-case (top) thermal resistance

78.5

47.5

97.0

Junction-to-board thermal resistance

39.5

13.9

42.6

°C/W

Junction-to-top characterization parameter

2.86

6.8

2.9

Junction-to-board characterization parameter

38.7

13.8

42.9

Junction-to-case (bottom) thermal resistance

N/A

N/A

12.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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