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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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TPA2005D1ZQYRG1 Fiches technique(PDF) 2 Page - Texas Instruments |
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TPA2005D1ZQYRG1 Fiches technique(HTML) 2 Page - Texas Instruments |
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2 / 32 page  ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS DISSIPATION RATINGS TPA2005D1 SLOS369F – JULY 2002 – REVISED JULY 2008............................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE(1) PART NUMBER SYMBOL MicroStar Junior™ (GQY) TPA2005D1GQYR(2) PB051 MicroStar Junior™ (ZQY)(3) TPA2005D1ZQYR(2) AAFI -40°C to 85°C 8-pin QFN (DRB) TPA2005D1DRBR (2) BIQ 8-pin MSOP (DGN) TPA2005D1DGN(R) BAL (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (2) The GQY, ZQY, and DRB packages are only available taped and reeled. An R at the end of the part number indicates the devices are taped and reeled. (3) The GQY is the standard MicroStar Junior™ package. The ZQY is lead-free option, and is qualified for 260° lead-free assembly. over operating free-air temperature range unless otherwise noted (1) UNIT In active mode -0.3 V to 6 V VDD Supply voltage(2) In SHUTDOWN mode -0.3 V to 7 V VI Input voltage -0.3 V to VDD + 0.3 V Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature -40°C to 85°C TJ Operating junction temperature -40°C to 85°C Tstg Storage temperature -65°C to 150°C 2.5 ≤ VDD ≤ 4.2 V 3.2 Ω (Minimum) RL Load resistance 4.2 < VDD ≤ 6 V 6.4 Ω (Minimum) (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) For the MSOP (DGN) package option, the maximum VDD should be limited to 5 V if short-circuit protection is desired. MIN NOM MAX UNIT VDD Supply voltage 2.5 5.5 V VIH High-level input voltage SHUTDOWN 2 VDD V VIL Low-level input voltage SHUTDOWN 0 0.8 V RI Input resistor Gain ≤ 20 V/V (26 dB) 15 k Ω VIC Common mode input voltage range VDD = 2.5 V, 5.5 V, CMRR ≤ -49 dB 0.5 VDD-0.8 V TA Operating free-air temperature -40 85 °C DERATING TA ≤ 25°C TA = 70°C TA = 85°C PACKAGE FACTOR POWER RATING POWER RATING POWER RATING GQY, ZQY 16 mW/°C 2 W 1.28 W 1.04 W DRB 21.8 mW/°C 2.7 W 1.7 W 1.4 W DGN 17.1 mW/°C 2.13 W 1.36 W 1.11 W 2 Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): TPA2005D1 |
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