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TLP620 Fiches technique(PDF) 2 Page - Toshiba Semiconductor |
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TLP620 Fiches technique(HTML) 2 Page - Toshiba Semiconductor |
2 / 9 page TLP620,TLP620−2,TLP620−4 2007-10-01 2 Made In Japan Made In Thailand UL recognized E67349 *1 E152349 *1 BSI approved 7426, 7427 *2 7426, 7427 *2 *1 UL1577 *2 BS EN60065: 2002, BS EN60950-1: 2002 • Isolation voltage: 5000Vrms (min.) • Option (D4) type VDE approved: DIN EN 60747-5-2, certificate no.40009302 Maximum operating insulation voltage: 890VPK Highest permissible over voltage: 8000VPK (Note) When an EN 60747-5-2 approved type is needed, please designate the “Option(D4)”. • Creepage distance: 6.4mm (min.) Clearance: 6.4mm (min.) Insulation thickness: 0.4mm (min.) Absolute Maximum Ratings (Ta = 25°C) Rating Characteristic Symbol TLP620 TLP620 −2 TLP620 −4 Unit Forward current IF (RMS) 60 50 mA Forward current derating ΔIF / °C −0.7 (Ta ≥ 39°C) −0.5 (Ta ≥ 25°C) mA / °C Pulse forward current IFP 1 (100μs pulse, 100pps) A Power dissipation (1 circuit) PD 100 70 mW Power dissipation derating ΔPD / °C −1.0 −0.7 mW / °C Junction temperature Tj 125 °C Collector −emitter voltage VCEO 55 V Emitter −collector voltage VECO 7 V Collector current IC 50 mA Collector power dissipation (1 circuit) PC 150 100 mW Collector power dissipation derating (1 circuit) (Ta ≥ 25°C) ΔPC / °C −1.5 −1.0 mW / °C Junction temperature Tj 125 °C Storage temperature range Tstg −55~125 °C Operating temperature range Topr −55~100 °C Lead soldering temperature Tsold 260 (10s) °C Total package power dissipation PT 250 150 mW Total package power dissipation derating (Ta ≥ 25°C, 1 circuit) ΔPT / °C −2.5 −1.5 mW / °C Isolation voltage BVS 5000 (AC, 1 min., RH ≤ 60%) Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). |
Numéro de pièce similaire - TLP620 |
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Description similaire - TLP620 |
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