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ADXL377BCPZ-RL Fiches technique(PDF) 8 Page - Analog Devices

No de pièce ADXL377BCPZ-RL
Description  Small, Low Power, 3-Axis 200 g Accelerometer
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADXL377BCPZ-RL Fiches technique(HTML) 8 Page - Analog Devices

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ADXL377
Data Sheet
Rev. 0 | Page 8 of 12
THEORY OF OPERATION
The ADXL377 is a complete 3-axis acceleration measurement
system with a typical measurement range of ±200 g. The ADXL377
contains a polysilicon, surface-micromachined sensor and signal
conditioning circuitry to implement an open-loop acceleration
measurement architecture. The output signals are analog voltages
that are proportional to acceleration. The accelerometer can mea-
sure the static acceleration of gravity in tilt-sensing applications,
as well as dynamic acceleration resulting from motion, shock,
or vibration.
The sensor is a polysilicon, surface-micromachined structure
built on top of a silicon wafer. Polysilicon springs suspend the
structure over the surface of the wafer and provide resistance
against acceleration forces. Deflection of the structure is mea-
sured using a differential capacitor that consists of independent
fixed plates and plates attached to the moving mass. The fixed
plates are driven by 180° out-of-phase square waves. Acceleration
deflects the moving mass and unbalances the differential capacitor,
resulting in a sensor output whose amplitude is proportional to
acceleration. Phase-sensitive demodulation techniques are then
used to determine the magnitude and direction of the acceleration.
The demodulator output is amplified and brought off chip through
a 32 kΩ resistor. The user then sets the signal bandwidth of the
device by adding a capacitor. This filtering improves measurement
resolution and helps prevent aliasing.
MECHANICAL SENSOR
The ADXL377 uses a single structure for sensing the accelera-
tion in the x-axis, y-axis, and z-axis. As a result, the three sense
directions are highly orthogonal with little cross-axis sensitivity.
Mechanical misalignment of the sensor die to the package or
misalignment of the package to the PCB is the chief source of
cross-axis sensitivity. Mechanical misalignment can be calibrated
at the system level.
PERFORMANCE
Rather than using additional temperature compensation circuitry,
the ADXL377 uses innovative design techniques to ensure high
performance. As a result, there is neither quantization error nor
nonmonotonic behavior, and temperature hysteresis is very low.


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