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AD9139-EBZ Fiches technique(PDF) 7 Page - Analog Devices

No de pièce AD9139-EBZ
Description  16-Bit, 1600 MSPS, TxDAC Digital-to- Analog Converter
Download  56 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD9139-EBZ Fiches technique(HTML) 7 Page - Analog Devices

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Data Sheet
AD9139
Rev. 0 | Page 7 of 56
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD33 to GND
−0.3 V to +3.6 V
DVDD18, CVDD18 to GND
−0.3 V to +2.1 V
FSADJ, VREF, DACOUTP/DACOUTN, to
GND
−0.3 V to AVDD33 + 0.3 V
D15P to D0P/D15N to D0N,
FRAMEP/FRAMEN, DCIP/DCIN to
GND
−0.3 V to DVDD18 + 0.3 V
DACCLKP/DACCLKN,
REFP/SYNCP/REFN/SYNCN to GND
−0.3 V to CVDD18 + 0.3 V
RESET, IRQ1, IRQ2, CS, SCLK, SDIO
to GND
−0.3 V to DVDD18 + 0.3 V
Junction Temperature
125°C
Storage Temperature Range
−65°C to +150°C
THERMAL RESISTANCE
The exposed pad (EPAD) must be soldered to the ground plane
(AVSS) for the 72-lead LFCSP. The EPAD provides an electrical,
thermal, and mechanical connection to the board.
Typical θJA, θJB, and θJC values are specified for a 4-layer board in
still air. Airflow increases heat dissipation, effectively reducing
θJA and θJB.
Table 7. Thermal Resistance
Package
θJA
θJB
θJC
Unit
Conditions
72-Lead LFCSP
20.7
10.9
1.1
°C/W
EPAD soldered
to ground plane
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.


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