THERMAL

PAD

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

KFF

RT

BP5

SYNC

SGND

SS/SD

VFB

COMP

ILIM

VIN

HDRV

BPN10

SW

BP10

LDRV

PGND

(TOP VIEW)

TPS40060

TPS40061

SLUS543F – DECEMBER 2002 – REVISED JUNE 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

LOAD CURRENT

PART NUMBER

Plastic HTSSOP (PWP)

TPS40060PWP

–40°C to 85°C

Plastic HTSSOP (PWP)

TPS40061PWP

(1)

The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS40060PWPR). See the Application

Information of the data sheet for PowerPAD drawing and layout information.

(2)

See Application Information section.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

TPS40060

TPS40061

VIN

60 V

VFB, SS/SD, SYNC

–0.3 V to 6 V

Input voltage range

–0.3 V to 60 V or VIN+5 V

SW

(whichever is less)

SW. transient < 50 ns

–2.5 V

Output voltage range

COMP, RT, KFF, SS

–0.3 V to 6 V

Input current

KFF

5 mA

Output current

RT

200 µA

Operating junction temperature range

–40°C to 125°C

Storage temperature

–55°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN NOM

MAX

UNIT

Input voltage

10

55

V

Operating free-air temperature

–40

85

°C

(1)

For more information on the PWP package, refer to TI Technical Brief (SLMA002).

(2)

PowerPAD™ heat slug must be connected to SGND (Pin 5), or electrically isolated from all other pins.

2

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