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ADMP421BCEZ-RL Fiches technique(PDF) 9 Page - Analog Devices |
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ADMP421BCEZ-RL Fiches technique(HTML) 9 Page - Analog Devices |
9 / 17 page ADMP421 Data Sheet Rev. D | Page 8 of 16 PCB LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP421 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 8. Care should be taken to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. 4× 0.40 × 0.60 (0.30) 0.90 (0.30) ø1.70 3.80 (0.30) (1.000) (0.550) 0.35 2.80 2× R0.10 (0.30) 0.35 2.05 0.70 ø1.10 CENTER LINE Figure 8. Suggested PCB Land Pattern Layout 1.45 0.9 2.45 0.7 1.525 1.000 0.35 1.849 1.849 1.498 0.205 WIDE 0.248 × 0.498 (2×) 0.248 × 1.148 (2×) 0.248 × 0.948 (2×) 1.498 × 0.248 0.398 × 0.298 (4×) 0.362 CUT (3×) 1.17 24° 24° 0.375 CENTER LINE Figure 9. Suggested Solder Paste Stencil Pattern Layout |
Numéro de pièce similaire - ADMP421BCEZ-RL |
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Description similaire - ADMP421BCEZ-RL |
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