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AD7818ARM-REEL Fiches technique(PDF) 7 Page - Analog Devices |
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AD7818ARM-REEL Fiches technique(HTML) 7 Page - Analog Devices |
7 / 20 page Data Sheet AD7817/AD7818 Rev. D | Page 7 of 20 ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise noted. Table 3. Parameter Rating V DD to AGND −0.3 V to +7 V V DD to DGND −0.3 V to +7 V Analog Input Voltage to AGND V IN1 to VIN4 −0.3 V to V DD + 0.3 V Reference Input Voltage to AGND1 −0.3 V to V DD + 0.3V Digital Input Voltage to DGND –0.3 V to V DD + 0.3 V Digital Output Voltage to DGND –0.3 V to V DD + 0.3 V Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 16-Lead TSSOP, Power Dissipation 450 mW θ JA Thermal Impedance 120°C/W Lead Temperature, Soldering 260°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 16-Lead SOIC Package, Power Dissipation 450 mW θ JA Thermal Impedance 100°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead SOIC Package, Power Dissipation 450 mW θ JA Thermal Impedance 157°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 8-Lead MSOP Package, Power Dissipation 450 mW θ JA Thermal Impedance 206°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 If the reference input voltage is likely to exceed V DD by more than 0.3 V (that is, during power-up) and the reference is capable of supplying 30 mA or more, it is recommended to use a clamping diode between the REFIN pin and VDD pin. Connect the diode as shown in this figure. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
Numéro de pièce similaire - AD7818ARM-REEL |
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Description similaire - AD7818ARM-REEL |
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