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AD845SQ Fiches technique(PDF) 3 Page - Analog Devices |
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AD845SQ Fiches technique(HTML) 3 Page - Analog Devices |
3 / 12 page AD845 REV. E –3– ORDERING GUIDE Temperature Package Package Model Range Description Option 1 AD845JN 0 ∞C to 70∞C 8-Lead PDIP N-8 AD845KN 0 ∞C to 70∞C 8-Lead PDIP N-8 AD845JR-16 0 ∞C to 70∞C 16-Lead SOIC R-16 AD845JR-16-REEL 0 ∞C to 70∞CTape and Reel R-16 AD845JR-16-REEL7 0 ∞C to 70∞CTape and Reel R-16 AD845AQ –40 ∞C to +85∞C 8-Lead CERDIP Q-8 AD845BQ –40 ∞C to +85∞C 8-Lead CERDIP Q-8 AD845SQ –55 ∞C to +125∞C 8-Lead CERDIP Q-8 AD845SQ/883B –55 ∞C to +125∞C 8-Lead CERDIP Q-8 5962-8964501PA 2 –55 ∞C to +125∞C 8-Lead CERDIP Q-8 AD845JCHIPS 0 ∞C to 70∞CDie NOTES 1N = Plastic DIP; Q = CERDIP; R = Small Outline IC (SOIC). 2See military data sheet. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Internal Power Dissipation 2 Plastic Mini-DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.6 W CERDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4 W 16-Lead SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5 W Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +VS Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite Differential Input Voltage . . . . . . . . . . . . . . . . . . +VS and –VS Storage Temperature Range Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65 ∞C to +150∞C N, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65 ∞C to +125∞C Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300 ∞C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Mini-DIP package: qJA = 100∞C/W; CERDIP package: qJA = 110∞C/W; SOIC package: qJA = 100∞C/W. METALIZATION PHOTOGRAPH Dimensions shown in inches and (mm). Contact factory for latest dimensions. SUBSTRATE CONNECTED TO +V S |
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