9:;<:=>@A

BCDFGHIJK

LIMNOP

M

HQLBRSSGLJJOG

TUVWTYZ

[

Y\

1

2

2

2

2

3~5

6~7

8

8

8

9

10

List

List.................................................................................................

Package outline...............................................................................

Features..........................................................................................

Maximum ratings .............................................................................

Electrical characteristics...................................................................

Rating and characteristic curves........................................................

Pinning information...........................................................................

Marking............................................................................................

Suggested thermal profiles for soldering processes.............................

High reliability test capabilities...........................................................

Mechanical data...............................................................................

Suggested solder pad layout..............................................................

Page 1

Document ID

Issued Date

Revised Date

Revision

Page.

DS-121838

2010/06/10

2012/11/21

F

10

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141