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5-104895-4 Fiches technique(PDF) 2 Page - Tyco Electronics |
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5-104895-4 Fiches technique(HTML) 2 Page - Tyco Electronics |
2 / 13 page 89 Catalog 889092 Dimensions are in millimeters Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-3611-1514 Revised 9-06 and inches unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628 specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013 www.tycoelectronics.com are standard equivalents. to change. C. America: 52-55-5-729-0425 UK: 44-141-810-8967 Page_Head (Continued) Fine Pitch SMT Stacking Connectors (Parallel Board-to-Board) AMPMODU 50/50 Grid Connectors Product Facts ■ Surface-mount products for parallel board-to-board applications, as well as right angle board-to-board and cable-to-board applications ■ High density 1.27 x 1.27 [.050 x .050] centerline grid ■ Three board-to-board stack heights: 6.35 [.250], 8.13 [.320] and 9.91 [.390] ■ Non-protrusive metallic holddowns ■ Reliable dual beam receptacle contacts for redundant contact ■ Duplex plated receptacle and post contacts; gold plated on mating areas, tin-lead plated on tails ■ Compatible with standard surface-mount processing (VPR and IR) ■ Receptacle and header allow for drainage of processing fluids ■ Tape and reel packaging available, contact Tyco Electronics for details ■ Polarized header and receptacle assemblies ■ Sizes of 10, 20, 30, 40, 50, 60, 70, 80 and 100 positions ■ Recognized under the Component Program of Underwriters Laboratories Inc., File No. E28476 ■ Certified by Canadian Standards Association File No. LR7189 R R AMPMODU 50/50 Grid Vertical Headers and Receptacles are designed for parallel board-to-board stacking in high density applications. Right angle board-to-board and cable-to-board applica- tions are also possible, since the vertical recepta- cles also mate with non- latching right angle headers (page 95) and the vertical headers also mate with non- latching cable connectors. Available are dual-row, vertical shrouded headers and receptacles in sizes ranging from 10 through 100 positions (in 10 position increments). Parallel board-to-board stack heights of 6.35 [.250], 8.13 [.320] and 9.91 [.390] are achievable by selection of the appropriate header. The receptacle is the same for all three stack height headers. Non-protrusive metallic holddowns are designed for use in 1.57 [.062] or thicker PC boards and allow sur- face mounting to both sides of the board. In addition to providing retention during processing, the holddowns are soldered during reflow and therefore provide long term strain relief for the lead solder joints. AMPMODU 50/50 Grid Vertical Headers and Receptacles are compatible with standard surface- mount processes; IR (infrared) and VPR (vapor phase reflow). The surface- mount connectors have been designed so that dimensioning, tolerances, referenced datums, hold- down characteristics and packaging methods result in a system that is compati- ble with robotic assembly. The headers and recepta- cles feature polarization to prevent misalignment. Three Board Stack Heights Non-Protrusive Metallic Holddowns 6.35 ± 0.15 [.250 ± .006] 8.13 ± 0.15 [.320 ± .006] 9.91 ± 0.15 [.390 ± .006] See Catalog 1307819 for additional AMPMODU product offerings. |
Numéro de pièce similaire - 5-104895-4 |
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