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LM37101RS-3.3 Fiches technique(PDF) 10 Page - HTC Korea TAEJIN Technology Co. |
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LM37101RS-3.3 Fiches technique(HTML) 10 Page - HTC Korea TAEJIN Technology Co. |
10 / 11 page 1A Low-Voltage Low-Dropout Regulator LM37101/37102 Nov. 2011 – R1.1 - 10 - HTC application. With respect to the applied package, the maximum output current of 1A may be still undeliverable due to the restriction of the power dissipation of LM37101/2. Under all possible conditions, the junction temperature must be within the range specified under operating conditions. The temperatures over the device are given by: TC = TA + PD X θCA / TJ = TC + PD X θJC / TJ = TA + PD X θJA where TJ is the junction temperature, TC is the case temperature, TA is the ambient temperature, PD is the total power dissipation of the device, θCA is the thermal resistance of case-to-ambient, θJC is the thermal resistance of junction-to-case, and θJA is the thermal resistance of junction to ambient. The total power dissipation of the device is given by: PD = PIN – POUT = (VIN X IIN)–(VOUT X IOUT) = (VIN X (IOUT+IGND)) – (VOUT X IOUT) = (VIN - VOUT) X IOUT + VIN X IGND where IGND is the operating ground current of the device which is specified at the Electrical Characteristics. The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the application, and the maximum allowable junction temperature (TJmax): TRmax = TJmax – TAmax The maximum allowable value for junction-to-ambient thermal resistance, θJA, can be calculated using the formula: θJA = TRmax / PD = (TJmax – TAmax) / PD LM37101/2 is available in SOP-8 package. The thermal resistance depends on amount of copper area or heat sink, and on air flow. If the maximum allowable value of θJA calculated above is over 130°C/W for SOP-8 package, no heat sink is needed since the package can dissipate enough heat to satisfy these requirements. If the value for allowable θJA falls near or below these limits, a heat sink or proper area of copper plane is required. In summary, the absolute maximum ratings of thermal resistances are as follow: Absolute Maximum Ratings of Thermal Resistance Characteristic Symbol Rating Unit Thermal Resistance Junction-To-Ambient / SOP-8 θJA-SOP-8 130 °C/W Thermal Resistance Junction-To-Ambient / TO-252 θJA-TO-252 95 °C/W No heat sink / No air flow / No adjacent heat source / 20 mm 2 copper area. (T A=25°C) |
Numéro de pièce similaire - LM37101RS-3.3 |
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Description similaire - LM37101RS-3.3 |
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