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TPS61162D Fiches technique(PDF) 2 Page - Texas Instruments

No de pièce TPS61162D
Description  Dual-Channel WLED Drivers For Smart Phone
Download  26 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TPS61162D Fiches technique(HTML) 2 Page - Texas Instruments

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TPS61162D
SLVSC13 – JULY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
TA
PART NUMBER
OPEN LED PROTECTION
PACKAGE
ORDERING
PACKAGE MARKING
–40°C to 85°C
TPS61162D
26.5V (typical)
9-ball WSCP
TPS61162DYFF
TPS61162D
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN
MAX
VIN, EN, PWM, IFB1, IFB2
–0.3
7
V
Voltage range(2)
COMP, ISET
–0.3
3
V
SW
–0.3
40
V
Human Body Mode – (HBM)
2
kV
ESD rating
Machine Mode – (MM)
200
V
Charge Device Mode – (CDM)
750
V
PD
Continuous power dissipation
See Thermal Information Table
TJ
Operating junction temperature range
–40
150
°C
TSTG
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
TPS61162D
THERMAL METRIC(1)
UNITS
YFF (9-ball WSCP)
θJA
Junction-to-ambient thermal resistance
107
θJCtop
Junction-to-case (top) thermal resistance
0.9
θJB
Junction-to-board thermal resistance
18.1
°C/W
ψJT
Junction-to-top characterization parameter
4.0
ψJB
Junction-to-board characterization parameter
18
θJCbot
Junction-to-case (bottom) thermal resistance
NA
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
VIN
Input voltage range
2.7
6.5
V
VOUT
Output voltage range
VIN
27
V
L
Inductor
4.7
10
µH
CI
Input capacitor
1.0
µF
CO
Output capacitor
1.0
2.2
µF
CCOMP
Compensation capacitor
330
nF
FPWM
PWM dimming signal frequency
40
100
kHz
TA
Operating ambient temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
2
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TPS61162D


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