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LM2575HV Fiches technique(PDF) 11 Page - Texas Instruments |
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LM2575HV Fiches technique(HTML) 11 Page - Texas Instruments |
11 / 44 page LM1575, LM2575-N, LM2575HV www.ti.com SNVS106E – MAY 1999 – REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) (Circuit Figure 25 and Figure 26) Maximum Power Dissipation Feedback Pin Current (TO-263) (See (1)) Figure 21. Figure 22. Switching Waveforms Load Transient Response VOUT = 5V A: Output Pin Voltage, 10V/div B: Output Pin Current, 1A/div C: Inductor Current, 0.5A/div D: Output Ripple Voltage, 20 mV/div, AC-Coupled Horizontal Time Base: 5 μs/div Figure 23. Figure 24. (1) If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LM1575 LM2575-N LM2575HV |
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