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74LVC1G126GN Fiches technique(PDF) 2 Page - NXP Semiconductors

No de pièce 74LVC1G126GN
Description  Bus buffer/line driver; 3-state
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

74LVC1G126GN Fiches technique(HTML) 2 Page - NXP Semiconductors

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74LVC1G126
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 12 — 2 July 2012
2 of 21
NXP Semiconductors
74LVC1G126
Bus buffer/line driver; 3-state
3.
Ordering information
4.
Marking
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5.
Functional diagram
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC1G126GW
40 Cto+125 C
TSSOP5
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
SOT353-1
74LVC1G126GV
40 Cto+125 C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
74LVC1G126GM
40 Cto+125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
 1.45  0.5 mm
SOT886
74LVC1G126GF
40 C to +125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
 1  0.5 mm
SOT891
74LVC1G126GN
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 0.9
 1.0  0.35 mm
SOT1115
74LVC1G126GS
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 1.0
 1.0  0.35 mm
SOT1202
74LVC1G126GX
40 C to +125 C
X2SON5
X2SON5: plastic thermal enhanced extremely
thin small outline package; no leads; 5
terminals; body 0.8
 0.8  0.35 mm
SOT1226
Table 2.
Marking codes
Type number
Marking[1]
74LVC1G126GW
VN
74LVC1G126GV
V26
74LVC1G126GM
VN
74LVC1G126GF
VN
74LVC1G126GN
VN
74LVC1G126GS
VN
74LVC1G126GX
VN
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Logic diagram
mna125
A
OE
Y
2
1
4
mna126
1
4
OE
2
mna127
OE
A
Y


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