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ADMP510 Fiches technique(PDF) 8 Page - Analog Devices |
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ADMP510 Fiches technique(HTML) 8 Page - Analog Devices |
8 / 12 page ADMP510 Data Sheet Rev. 0 | Page 8 of 12 PCB DESIGN AND LAND PATTERN LAYOUT Lay out the PCB land pattern for the ADMP510 at a 1:1 ratio to the solder pads on the microphone package (see Figure 13). Take care to avoid applying solder paste to the sound hole in the PCB. Figure 14 shows a suggested solder paste stencil pattern layout. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. Ø1.55 Ø0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 Figure 13. Suggested PCB Land Pattern Layout 1.22 2× 0.8 × 0.6 0.2 × 45° TYP 1.52mm 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) Figure 14. Suggested Solder Paste Stencil Pattern Layout |
Numéro de pièce similaire - ADMP510 |
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Description similaire - ADMP510 |
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