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HCPL-5631 Fiches technique(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-5631 Fiches technique(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED |
6 / 12 page 6 Absolute Maximum Ratings No derating required up to +125°C. Parameter Symbol Min. Max. Units Storage Temperature T S -65 +150 °C Operating Temperature T A -55 +125 °C Case Temperature T C +170 °C Junction Temperature T J +175 °C Lead Solder Temperature 260 for 10 sec °C Peak Forward Input Current (each channel, ≤1 ms duration) I F(PEAK) 40 mA Average Input Forward Current (each channel) I F(AVG) 20 mA Input Power Dissipation (each channel) 35 mW Reverse Input Voltage (each channel V R 5V Supply Voltage (1 minute maximum) V CC 7.0 V Output Current (each channel) I O 25 mA Output Voltage (each channel) V O 7* V Output Power Dissipation (each channel) P O 40 mW Package Power Dissipation (each channel) P D 200 mW *Selection for higher output voltages up to 20 V is available Single Channel Product Only Enable Input Voltage V E 5.5 V Note enable pin 7. An external 0.01 μF to 0.1 μF bypass capacitor must be connected between V CC and ground for each package type. 8 Pin Ceramic DIP Single Channel Schematic ESD Classification (MIL-STD-883, Method 3015) HCPL-5600/01/0K ( ), Class 1 6N134, 6N134/883B, HCPL-5630/31/3K, HCPL-5650/51, HCPL-6630/31/3K and HCPL-6650/51/5K (Dot), Class 3 Recommended Operating Conditions Parameter Symbol Min. Max. Units Input Current, Low Level, Each Channel I FL 0 250 μA Input Current, High Level, Each Channel* I FH 10 20 mA Supply Voltage, Output V CC 4.5 5.5 V Fan Out (TTL Load) Each Channel N 6 *Meets or exceeds DLA SMD and JEDEC requirements. |
Numéro de pièce similaire - HCPL-5631 |
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Description similaire - HCPL-5631 |
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