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MCZ33999ER2 Fiches technique(PDF) 4 Page - Freescale Semiconductor, Inc

No de pièce MCZ33999ER2
Description  16-Output Switch with SPI and PWM Control
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Fabricant  FREESCALE [Freescale Semiconductor, Inc]
Site Internet  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MCZ33999ER2 Fiches technique(HTML) 4 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
4
Freescale Semiconductor
33999
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VPWR Supply Voltage (1)
VPWR
-1.5 to 50
V
SPI Interface Logic Supply Voltage (1)
SOPWR
-0.3 to 7.0
V
SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST, PWMn) (1)
VIN
-0.3 to 7.0
V
Output Drain Voltage
VDS
-0.3 to 45
V
Frequency of SPI Operation (2)
fSPI
6.0
MHz
Output Clamp Energy (3)
ECLAMP
50
mJ
ESD Voltage (4)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
TA
TJ
TC
-40 to 125
-40 to 150
-40 to 125
C
Storage Temperature
TSTG
-55 to 150
C
Power Dissipation (TA  25C) (5)
PD
1.7
W
Peak Package Reflow Temperature During Reflow (6), (7)
TPPRT
Note 7
°C
Thermal Resistance
Junction-to-Ambient (8)
Junction- to-Lead (9)
Junction-to-Flag
RJA
RJL
RJC
75
8.0
1.2
C/W
Notes
1.
Exceeding these limits may cause malfunction or permanent damage to the device.
2.
This parameter is guaranteed by design but not production tested.
3.
Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.
4.
ESD data is available upon request. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500
) and the Machine Model (CZAP = 200 pF, RZAP = 0 ).
5.
Maximum power dissipation with no heat sink used.
6.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
7.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
8.
Tested per JEDEC test JESD52-2 (single-layer PWB).
9.
Tested per JEDEC test JESD51-8 (two-layer PWB).


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