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MCZ33999ER2 Fiches technique(PDF) 4 Page - Freescale Semiconductor, Inc |
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MCZ33999ER2 Fiches technique(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 21 page Analog Integrated Circuit Device Data 4 Freescale Semiconductor 33999 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS VPWR Supply Voltage (1) VPWR -1.5 to 50 V SPI Interface Logic Supply Voltage (1) SOPWR -0.3 to 7.0 V SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST, PWMn) (1) VIN -0.3 to 7.0 V Output Drain Voltage VDS -0.3 to 45 V Frequency of SPI Operation (2) fSPI 6.0 MHz Output Clamp Energy (3) ECLAMP 50 mJ ESD Voltage (4) Human Body Model Machine Model VESD1 VESD2 ±2000 ±200 V THERMAL RATINGS Operating Temperature Ambient Junction Case TA TJ TC -40 to 125 -40 to 150 -40 to 125 C Storage Temperature TSTG -55 to 150 C Power Dissipation (TA 25C) (5) PD 1.7 W Peak Package Reflow Temperature During Reflow (6), (7) TPPRT Note 7 °C Thermal Resistance Junction-to-Ambient (8) Junction- to-Lead (9) Junction-to-Flag RJA RJL RJC 75 8.0 1.2 C/W Notes 1. Exceeding these limits may cause malfunction or permanent damage to the device. 2. This parameter is guaranteed by design but not production tested. 3. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method. 4. ESD data is available upon request. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ) and the Machine Model (CZAP = 200 pF, RZAP = 0 ). 5. Maximum power dissipation with no heat sink used. 6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 8. Tested per JEDEC test JESD52-2 (single-layer PWB). 9. Tested per JEDEC test JESD51-8 (two-layer PWB). |
Numéro de pièce similaire - MCZ33999ER2 |
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Description similaire - MCZ33999ER2 |
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