Moteur de recherche de fiches techniques de composants électroniques |
|
ADV7611BSWZ-P Fiches technique(PDF) 7 Page - Analog Devices |
|
ADV7611BSWZ-P Fiches technique(HTML) 7 Page - Analog Devices |
7 / 16 page Data Sheet ADV7611 Rev. D | Page 7 of 16 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating DVDD to GND 2.2 V PVDD to GND 2.2 V DVDDIO to GND 4.0 V CVDD to GND 2.2 V TVDD to GND 4.0 V Digital Inputs Voltage to GND GND − 0.3 V to DVDDIO + 0.3 V 5 V Tolerant Digital Inputs to GND1 5.3 V Digital Outputs Voltage to GND GND − 0.3 V to DVDDIO + 0.3 V XTALP, XTALN GND − 0.3 V to PVDD + 0.3 V SCL/SDA Data Pins to DVDDIO DVDDIO − 0.3 V to DVDDIO + 3.6 V Maximum Junction Temperature (TJMAX) 125°C Storage Temperature Range −60°C to +150°C Infrared Reflow Soldering (20 sec) 260°C 1 The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL and DDCA_SDA. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL PERFORMANCE To reduce power consumption when using the ADV7611, the user is advised to turn off the unused sections of the part. Due to the printed circuit board (PCB) metal variation, and, therefore, variation in PCB heat conductivity, the value of θJA may differ for various PCBs. The most efficient measurement solution is obtained using the package surface temperature to estimate the die temperature because this eliminates the variance associated with the θJA value. The maximum junction temperature (TJ MAX) of 125°C must not be exceeded. The following equation calculates the junction tempera- ture using the measured package surface temperature and applies only when no heat sink is used on the device under test (DUT): ( ) TOTAL JT S J W Ψ T T × + = where: TS is the package surface temperature (°C). ΨJT = 0.4°C/W for the 64-lead LQFP_EP. WTOTAL = ((PVDD × IPVDD) + (0.05 × TVDD × ITVDD) + (CVDD × ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO)) where 0.05 is 5% of the TVDD power that is dissipated on the part itself. ESD CAUTION |
Numéro de pièce similaire - ADV7611BSWZ-P |
|
Description similaire - ADV7611BSWZ-P |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |