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ADV7611BSWZ-RL Fiches technique(PDF) 7 Page - Analog Devices

No de pièce ADV7611BSWZ-RL
Description  Low Power 165 MHz HDMI Receiver
Download  16 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADV7611BSWZ-RL Fiches technique(HTML) 7 Page - Analog Devices

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Data Sheet
ADV7611
Rev. D | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
DVDD to GND
2.2 V
PVDD to GND
2.2 V
DVDDIO to GND
4.0 V
CVDD to GND
2.2 V
TVDD to GND
4.0 V
Digital Inputs Voltage to GND
GND − 0.3 V to DVDDIO + 0.3 V
5 V Tolerant Digital Inputs to
GND1
5.3 V
Digital Outputs Voltage to GND
GND − 0.3 V to DVDDIO + 0.3 V
XTALP, XTALN
GND − 0.3 V to PVDD + 0.3 V
SCL/SDA Data Pins to DVDDIO
DVDDIO − 0.3 V to DVDDIO +
3.6 V
Maximum Junction Temperature
(TJMAX)
125°C
Storage Temperature Range
−60°C to +150°C
Infrared Reflow Soldering (20 sec)
260°C
1
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL and
DDCA_SDA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7611, the
user is advised to turn off the unused sections of the part.
Due to the printed circuit board (PCB) metal variation, and,
therefore, variation in PCB heat conductivity, the value of θJA
may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this eliminates the variance associated with the θJA value.
The maximum junction temperature (TJ MAX) of 125°C must not be
exceeded. The following equation calculates the junction tempera-
ture using the measured package surface temperature and applies
only when no heat sink is used on the device under test (DUT):
(
)
TOTAL
JT
S
J
W
Ψ
T
T
×
+
=
where:
TS is the package surface temperature (°C).
ΨJT = 0.4°C/W for the 64-lead LQFP_EP.
WTOTAL = ((PVDD × IPVDD) + (0.05 × TVDD × ITVDD) + (CVDD ×
ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO))
where 0.05 is 5% of the TVDD power that is dissipated on the
part itself.
ESD CAUTION


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