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LM1117MP-ADJ/NOPB Fiches technique(PDF) 7 Page - Texas Instruments |
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LM1117MP-ADJ/NOPB Fiches technique(HTML) 7 Page - Texas Instruments |
7 / 30 page LM1117-N www.ti.com SNOS412L – MAY 2004 – REVISED JULY 2012 LM1117I ELECTRICAL CHARACTERISTICS (continued) Typicals and limits appearing in normal type apply for TJ = 25°C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, −40°C to 125°C. Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units Thermal Resistance 3-Lead SOT-223 (No heat sink) 136 °C/W Junction-to-Ambient 3-Lead TO-252 (No heat sink)(6) 92 °C/W No air flow) 8-Lead LLP(7) 40 °C/W (6) Minimum pad size of 0.038in2 (7) Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22°C. For information about improved thermal performance and power dissipation for the LLP, refer to Application Note AN-1187. Copyright © 2004–2012, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LM1117-N |
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