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DAC3154IRGCR Fiches technique(PDF) 8 Page - Pan Jit International Inc. |
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DAC3154IRGCR Fiches technique(HTML) 8 Page - Pan Jit International Inc. |
8 / 46 page DAC3154 DAC3164 SLAS960 – MAY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VDDA33 to GND –0.5 to 4 VDDA18 to GND –0.5 to 2.3 Supply voltage CLKVDD18 to GND –0.5 to 2.3 V IOVDD to GND –0.5 to 4 DIGVDD18 to GND –0.5 to 2.3 CLKVDD18 to DIGVDD18 –0.5 to 0.5 VDDA18 to DIGVDD18 –0.5 to 0.5 D[11..0]P, D[11..0]N, DATACLKP, DATACLKN, SYNCP, SYNCN to GND –0.5 to DIGVDD18 + 0.5 Terminal voltage DACCLKP, DACCLKN, ALIGNP, ALIGNN –0.5 to CLKVDD18 + 0.5 V range TXENABLE, ALARM, SDO, SDIO, SCLK, SDENB, RESETB to GND –0.5 to IOVDD + 0.5 IOUTAP, IOUTAN, IOUTBP, IOUTBN to GND –0.7 to 1.4 EXTIO, BIASJ to GND –0.5 to VDDA33 + 0.5 Storage temperature range –65 to 150 °C ESD, Human Body Model 2 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION DAC3174 THERMAL METRIC(1) UNITS QFN (64 PIN) θJA Junction-to-ambient thermal resistance 23.0 θJCtop Junction-to-case (top) thermal resistance 7.6 θJB Junction-to-board thermal resistance 2.8 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 2.8 θJCbot Junction-to-case (bottom) thermal resistance 0.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: DAC3154 DAC3164 |
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