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ADV7610BBCZ Fiches technique(PDF) 7 Page - Analog Devices

No de pièce ADV7610BBCZ
Description  Low Power, 165 MHz HDMI Receiver
Download  16 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADV7610BBCZ Fiches technique(HTML) 7 Page - Analog Devices

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Data Sheet
ADV7610
Rev. 0 | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
DVDD to GND
2.2 V
PVDD to GND
2.2 V
DVDDIO to GND
4.0 V
CVDD to GND
2.2 V
TVDD to GND
4.0 V
Digital Inputs Voltage to GND
GND − 0.3 V to DVDDIO + 0.3 V
5 V Tolerant Digital Inputs to
GND1
5.3 V
Digital Outputs Voltage to GND
GND − 0.3 V to DVDDIO + 0.3 V
XTALP, XTALN
GND − 0.3 V to PVDD + 0.3 V
SCL/SDA Data Pins to DVDDIO
DVDDIO − 0.3 V to
DVDDIO + 3.6 V
Maximum Junction Temperature
(TJ MAX)
125°C
Storage Temperature Range
−60°C to +150°C
Infrared Reflow Soldering (20 sec)
260°C
1
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL, DDCA_SDA,
and RXA_5V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7610, turn
off the unused sections of the part.
Due to the PCB metal variation and, therefore, variation in PCB
heat conductivity, the value of θJA may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this eliminates the variance associated with the θJA value.
Do not exceed the maximum junction temperature (TJ MAX) of
125°C. The following equation calculates the junction temperature
using the measured package surface temperature, and it applies
only when a heat sink is not used on the device under test (DUT):
TJ = TS + (ΨJT × WTOTAL)
where:
TS is the package surface temperature (°C).
ΨJT = 0.4°C/W for the 76-ball CSP_BGA.
WTOTAL = ((PVDD × IPVDD) + (0.05 × TVDD × ITVDD) +
(CVDD × ICVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO))
where 0.05 is 5% of the TVDD power that is dissipated on the
device itself.
ESD CAUTION


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