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ADC081S021 Fiches technique(PDF) 3 Page - Texas Instruments

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No de pièce ADC081S021
Description  Single Channel, 0.5 to 1 Msps, 12-Bit A/D Converter
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

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ADC121S101
www.ti.com
SNAS304E – JANUARY 2006 – REVISED OCTOBER 2012
Absolute Maximum Ratings
(1) (2) (3)
Analog Supply Voltage VA
−0.3V to 6.5V
Voltage on Any Digital Pin to GND
−0.3V to 6.5V
Voltage on Any Analog Pin to GND
−0.3V to (VA +0.3V)
Input Current at Any Pin(4)
±10 mA
Package Input Current(4)
±20 mA
Power Consumption at TA = 25°C
See(5)
Human Body Model
3500V
ESD Susceptibility(6)
Machine Model
300V
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
(2)
All voltages are measured with respect to GND = 0V, unless otherwise specified.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4)
When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to
10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the VA pin. The current into the VA pin is
limited by the Analog Supply Voltage specification.
(5)
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDmax = (TJmax − TA) / θJA. The values for maximum power dissipation listed above will be reached only when the device is operated
in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
(6)
Human body model is 100 pF capacitor discharged through a 1.5 k
Ω resistor. Machine model is 220 pF discharged through zero ohms.
Operating Ratings
(1) (2)
Operating Temperature Range
−40°C ≤ TA ≤ +125°C
VA Supply Voltage
+2.7V to +5.25V
Digital Input Pins Voltage Range (regardless of supply voltage)
−0.3V to 5.25V
Analog Input Pins Voltage Range
0V to VA
Clock Frequency
25 kHz to 20 MHz
Sample Rate
up to 1 Msps
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
(2)
All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance
(1) (2)
Package
θJA
6-lead WSON
94°C / W
6-lead SOT-23
265°C / W
(1)
Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to
www.national.com/packaging
(2)
Reflow temperature profiles are different for lead-free and non-lead-free packages.
Copyright © 2006–2012, Texas Instruments Incorporated
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