Moteur de recherche de fiches techniques de composants électroniques |
|
ADN2841ACP-48 Fiches technique(PDF) 3 Page - Analog Devices |
|
ADN2841ACP-48 Fiches technique(HTML) 3 Page - Analog Devices |
3 / 12 page REV. 0 –3– ADN2841 Parameter Min Typ Max Unit Conditions/Comments IBMON, IMMON, IMPDMON, IMPDMON2 IBMON, IMMON Division Ratio 100 A/A IMPDMON, IMPDMON2 1 A/A IMPDMON to IMPDMON2 Matching 1 % IMPD = 1200 µA Compliance Voltage 0 VCC – 1.2 V SUPPLY ICC 5 0.05 A IBIAS = IMOD = 0 VCC 6 4.5 5.0 5.5 V NOTES 1Temperature Range: –40 °C to +85°C 2When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows in the IMODP pin. 3Guaranteed by design and characterization. Not production tested. 4IDTONE may cause eye distortion. 5I CC for power calculation is the typical I CC given. 6All V CCS should be shorted together. Specifications subject to change without notice. ABSOLUTE MAXIMUM RATINGS 1 (TA = 25 °C unless otherwise noted.) VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Operating Temperature Range Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40 °Cto +85°C Storage Temperature Range . . . . . . . . . . –65 °C to +150°C Junction Temperature (TJ MAX) . . . . . . . . . . . . . . . . . . 150 °C 48-Lead LFCSP Package Power Dissipation . . . . . . . . . . . . . . . (TJ MAX – TA)/ θ JA mW θJA Thermal Impedance2 . . . . . . . . . . . . . . . . . . . . 25°C/W Lead Temperature (Soldering for 10 sec) . . . . . . . . 300 °C ORDERING GUIDE Model Temperature Range Package Description ADN2841ACP-32 –40 °C to +85°C 32-Lead LFCSP ADN2841ACP-48 –40 °C to +85°C 48-Lead LFCSP ADN2841ACP-32-RL –40 °C to +85°C 32-Lead LFCSP ADN2841ACP-32-RL7 –40 °C to +85°C 32-Lead LFCSP ADN2841ACP-48-RL –40 °C to +85°C 48-Lead LFCSP 32-Lead LFCSP Package Power Dissipation . . . . . . . . . . . . . . . (TJMAX –TA)/ θ JA mW θJA Thermal Impedance2 . . . . . . . . . . . . . . . . . . . . 32°C/W Lead Temperature (Soldering for 10 sec) . . . . . . . . . 300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Transient currents of up to 100 mA will not cause SCR latch-up. 2 θ JA is defined when the part is soldered onto a four-layer board. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADN2841 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE SETUP tS HOLD tH DATAP/N CLKP Figure 1. Setup and Hold Time |
Numéro de pièce similaire - ADN2841ACP-48 |
|
Description similaire - ADN2841ACP-48 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |