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ADN2841ACP-48 Fiches technique(PDF) 3 Page - Analog Devices

No de pièce ADN2841ACP-48
Description  Dual-Loop 50 Mbps.2.7 Gbps Laser Diode Driver
Download  12 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADN2841ACP-48 Fiches technique(HTML) 3 Page - Analog Devices

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REV. 0
–3–
ADN2841
Parameter
Min
Typ
Max
Unit
Conditions/Comments
IBMON, IMMON, IMPDMON, IMPDMON2
IBMON, IMMON Division Ratio
100
A/A
IMPDMON, IMPDMON2
1
A/A
IMPDMON to IMPDMON2 Matching
1
%
IMPD = 1200
µA
Compliance Voltage
0
VCC – 1.2
V
SUPPLY
ICC
5
0.05
A
IBIAS = IMOD = 0
VCC
6
4.5
5.0
5.5
V
NOTES
1Temperature Range: –40
°C to +85°C
2When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows in the IMODP pin.
3Guaranteed by design and characterization. Not production tested.
4IDTONE may cause eye distortion.
5I
CC for power calculation is the typical I CC given.
6All V
CCS should be shorted together.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°Cto +85°C
Storage Temperature Range . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ MAX) . . . . . . . . . . . . . . . . . . 150
°C
48-Lead LFCSP Package
Power Dissipation . . . . . . . . . . . . . . . (TJ MAX – TA)/
θ
JA mW
θJA Thermal Impedance2 . . . . . . . . . . . . . . . . . . . . 25°C/W
Lead Temperature (Soldering for 10 sec) . . . . . . . . 300
°C
ORDERING GUIDE
Model
Temperature Range
Package Description
ADN2841ACP-32
–40
°C to +85°C
32-Lead LFCSP
ADN2841ACP-48
–40
°C to +85°C
48-Lead LFCSP
ADN2841ACP-32-RL
–40
°C to +85°C
32-Lead LFCSP
ADN2841ACP-32-RL7
–40
°C to +85°C
32-Lead LFCSP
ADN2841ACP-48-RL
–40
°C to +85°C
48-Lead LFCSP
32-Lead LFCSP Package
Power Dissipation . . . . . . . . . . . . . . . (TJMAX –TA)/
θ
JA mW
θJA Thermal Impedance2 . . . . . . . . . . . . . . . . . . . . 32°C/W
Lead Temperature (Soldering for 10 sec) . . . . . . . . . 300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Transient currents of
up to 100 mA will not cause SCR latch-up.
2
θ
JA is defined when the part is soldered onto a four-layer board.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADN2841 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
SETUP
tS
HOLD
tH
DATAP/N
CLKP
Figure 1. Setup and Hold Time


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