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AD9777 Fiches technique(PDF) 5 Page - Analog Devices |
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AD9777 Fiches technique(HTML) 5 Page - Analog Devices |
5 / 48 page REV. 0 AD9777 –5– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9777 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE DIGITAL SPECIFICATIONS Parameter Min Typ Max Unit DIGITAL INPUTS Logic “1” Voltage 2.1 3 V Logic “0” Voltage 0 0.9 V Logic “1” Current –10 +10 µA Logic “0” Current –10 +10 µA Input Capacitance 5 pF CLOCK INPUTS Input Voltage Range 0 3 V Common-Mode Voltage 0.75 1.5 2.25 V Differential Voltage 0.5 1.5 V Specifications subject to change without notice. (TMIN to TMAX, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 0 V, DVDD = 3.3 V, IOUTFS = 20 mA, unless otherwise noted.) ABSOLUTE MAXIMUM RATINGS * Parameter With Respect to Min Max Unit AVDD, DVDD, CLKVDD AGND, DGND, CLKGND –0.3 +4.0 V AVDD, DVDD, CLKVDD AVDD, DVDD, CLKVDD –4.0 +4.0 V AGND, DGND, CLKGND AGND, DGND, CLKGND –0.3 +0.3 V REFIO, REFLO, FSADJ1/2 AGND –0.3 AVDD + 0.3 V IOUTA, IOUTB AGND –1.0 AVDD + 0.3 V P1B15–P1B0, P2B15–P2B0 DGND –0.3 DVDD + 0.3 V DATACLK, PLL_LOCK DGND –0.3 DVDD + 0.3 V CLK+, CLK–, RESET CLKGND –0.3 CLKVDD + 0.3 V LPF CLKGND –0.3 CLKVDD + 0.3 V SPI_CSB, SPI_CLK, DGND –0.3 DVDD + 0.3 V SPI_SDIO, SPI_SDO Junction Temperature +125 °C Storage Temperature –65 +150 °C Lead Temperature (10 sec) +300 °C *Stresses above those listed under the ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability. THERMAL CHARACTERISTICS Thermal Resistance 80-Lead Thermally Enhanced TQFP Package JA = 23.5 °C/W* *With thermal pad soldered to PCB. ORDERING GUIDE Temperature Package Package Model Range Description Option * AD9777BSV –40 °C to +85°C 80-Lead TQFP SV-80 AD9777EB Evaluation Board *SV = Thin Plastic Quad Flatpack |
Numéro de pièce similaire - AD9777 |
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Description similaire - AD9777 |
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