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AD5142ABRUZ10-RL7 Fiches technique(PDF) 11 Page - Analog Devices

No de pièce AD5142ABRUZ10-RL7
Description  The AD5122A/AD5142A are available in a compact, 16-lead, 3 mm 횞 3 mm LFCSP and a 16-lead TSSOP.
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD5142ABRUZ10-RL7 Fiches technique(HTML) 11 Page - Analog Devices

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Data Sheet
AD5122A/AD5142A
Rev. A | Page 11 of 32
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to GND
−0.3 V to +7.0 V
VSS to GND
+0.3 V to −7.0 V
VDD to VSS
7 V
VLOGIC to GND
−0.3 V to VDD + 0.3 V or
+7.0 V (whichever is less)
VA, VW, VB to GND
VSS − 0.3 V, VDD + 0.3 V
+7.0 V (whichever is less)
IA, IW, IB
Pulsed1
Frequency > 10 kHz
RAW = 10 kΩ
±6 mA/d2
RAW = 100 kΩ
±1.5 mA/d2
Frequency ≤ 10 kHz
RAW = 10 kΩ
±6 mA/√d2
RAW = 100 kΩ
±1.5 mA/√d2
Digital Inputs
−0.3 V to VLOGIC + 0.3 V or
+7 V (whichever is less)
Operating Temperature Range, TA3
−40°C to +125°C
Maximum Junction Temperature,
TJ Maximum
150°C
Storage Temperature Range
−65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max − TA)/θJA
ESD4
4 kV
FICDM
1.5 kV
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2
d = pulse duty factor.
3
Includes programming of EEPROM memory.
4
Human body model (HBM) classification.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is defined by the JEDEC JESD51 standard, and the value is
dependent on the test board and test environment.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
16-Lead LFCSP
89.51
3
°C/W
16-Lead TSSOP
150.41
27.6
°C/W
1
JEDEC 2S2P test board, still air (0 m/sec airflow).
ESD CAUTION


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