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AD9250 Fiches technique(PDF) 10 Page - Analog Devices

No de pièce AD9250
Description  14-Bit, 170 MSPS/250 MSPS, JESD204B,Dual Analog-to-Digital Converter
Download  44 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD9250 Fiches technique(HTML) 10 Page - Analog Devices

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AD9250
Data Sheet
Rev. 0 | Page 10 of 44
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
ELECTRICAL
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to AGND
−0.3 V to +2.0 V
DVDD to DGND
−0.3 V to +2.0 V
VIN+A/VIN+B, VIN−A/VIN−B to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND
−0.3 V to AVDD + 0.2 V
RFCLK to AGND
−0.3 V to AVDD + 0.2 V
VCM to AGND
−0.3 V to AVDD + 0.2 V
CS, PDWN to AGND
−0.3 V to AVDD + 0.3 V
SCLK to AGND
−0.3 V to AVDD + 0.3 V
SDIO to AGND
−0.3 V to AVDD + 0.3 V
RST to DGND
−0.3 V to DVDD + 0.3 V
FDA, FDB to DGND
−0.3 V to DVDD + 0.3 V
SERDOUT0+, SERDOUT0−,
SERDOUT1+, SERDOUT1− to AGND
−0.3 V to DRVDD + 0.3 V
SYNCINB+, SYNCINB− to DGND
−0.3 V to DVDD + 0.3 V
SYSREF+, SYSREF− to AGND
−0.3 V to AVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. This increases the reliability of the solder
joints, maximizing the thermal capability of the package.
Table 7. Thermal Resistance
PackageType
Airflow
Velocity
(m/sec)
θ
JA
1,2
θ
JC
1,3
θ
JB
1,4
Unit
48-Lead LFCSP
7 mm × 7 mm
(CP-48-13)
0
25
2
14
°C/W
1.0
22
°C/W
2.5
20
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-STD-883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer printed circuit board (PCB)
with a solid ground plane. As shown in Table 7, airflow increases
heat dissipation, which reduces θJA. In addition, metal in direct
contact with the package leads from metal traces, through holes,
ground, and power planes reduces the θJA.
ESD CAUTION


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