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FAN2013BMPX Fiches technique(PDF) 3 Page - Fairchild Semiconductor |
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FAN2013BMPX Fiches technique(HTML) 3 Page - Fairchild Semiconductor |
3 / 9 page © 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2013B • Rev. 1.0.2 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN Supply Voltage -0.3 7.0 V Input Voltage on PVIN and Any Other Pin -0.3 VIN V θJC Thermal Resistance, Junction-to-Tab (1) 8 °C/W TL Lead Soldering Temperature (10 Seconds) +260 °C TSTG Storage Temperature -65 +150 °C TJ Junction Temperature -40 +150 °C ESD Electrostatic Discharge Protection Level (2) Human Body Model, JESD22-A114 3.5 kV Charged Device Model, JESD22-C101 2.0 Notes: 1. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. 2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charged Device Model). Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbols Parameter Min. Typ. Max. Unit VIN Supply Voltage Range 4.5 5.5 V VOUT Output Voltage Range, Adjustable Version 0.8 2.5 V IOUT Output Current 2.0 A L Inductor (3) 2.2 µH CIN Input Capacitor (3) 10 20 µF COUT Output Capacitor (3) 20 40 µF TA Operating Ambient Temperature Range -40 +85 °C Note: 3. Refer to the Applications section for details . |
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