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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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FAN3223CMX Fiches technique(PDF) 2 Page - Fairchild Semiconductor |
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FAN3223CMX Fiches technique(HTML) 2 Page - Fairchild Semiconductor |
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2 / 24 page  © 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3223 / FAN3224 / FAN3225_F085 • Rev. 1.0.0 2 Ordering Information Part Number Logic Input Threshold Package Eco Status Packing Method Quantity per Reel FAN3223CMX_F085 Dual Inverting Channels + Dual Enable CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3223TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 FAN3224CMX_F085 Dual Non-Inverting Channels + Dual Enable CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3224TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 FAN3225CMX_F085 Dual Channels of Two-Input / One-Output Drivers CMOS SOIC-8 RoHS Tape & Reel 2,500 FAN3225TMX_F085 TTL SOIC-8 RoHS Tape & Reel 2,500 For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. Package Outline Figure 2. SOIC-8 (Top View) Thermal Characteristics(1) Package ΘJL (2) ΘJT (3) ΘJA (4) ΨJB (5) ΨJT (6) Units 8-Pin Small Outline Integrated Circuit (SOIC) 38 29 87 41 2.3 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( Θ JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( Θ JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA ( ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( Ψ JB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 4. For the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi_JT ( Ψ JT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 4. |
Numéro de pièce similaire - FAN3223CMX_12 |
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Description similaire - FAN3223CMX_12 |
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